Introduction
The lapping plate is made of high purity aluminum oxide with high density, high hardness, high strength and abrasion resistance. It is used for wafer polishing.
Size
Dia. 300-600mm
Property
| Composition % | 99.5-99.9 Alumina |
| Bulk density g/cm3 | 3.93-3.96 |
| Moisture absorption % | 0-0.01 |
| Flexure strength MPa | 370-550 |
| Vickers hardness GPa | 15 |
| Fracture toughness Mpa·m1/2 | 4.5 |
| Coefficient of thermal expansion (20-900℃)×10-6/K | 7.8 |
| Thermal conductivity (20℃) W/mk | 30 |
