Alumina Lapping Plates


The lapping plate is made of high purity aluminum oxide with high density, high hardness, high strength and abrasion resistance. It is used for wafer polishing.


Dia. 300-600mm


Composition % 99.5-99.9 Alumina
Bulk density g/cm3 3.93-3.96
Moisture absorption % 0-0.01
Flexure strength MPa 370-550
Vickers hardness GPa 15
Fracture toughness Mpa·m1/2 4.5
Coefficient of thermal expansion (20-900℃)×10-6/K 7.8
Thermal conductivity (20℃) W/mk 30

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