Aluminum Nitride (AlN) Substrates

Introduction

Aluminum nitride has properties of high thermal conductivity of 170 W/mK, excellent dielectric properties, and a low thermal expansion similar to silicon. ALN substrate is used for mainly semiconductor manufacturing devices, and also it can be used for vacuum evaporation system, sputtering machines and CVD devices.

Aluminum nitride substrates are produced by Tech Ceramic in different processes, tape casting or dry pressing. Substrates’ thickness produced by tape casting is up to 1.5mm while by dry pressing thickness is up to 6.35mm.

Our substrates are supplied ready to use or can be further processed, including mechanical dicing, laser scribing and cutting, thick film metallizing, thin film metallizing, DPC, DBC, TPC, AMB.

Substrate Sizes

Thickness (inch) Square Substrates Width x Length
2"x2" 3"x3" 4"x4" 4.5"x4.5" 5"x5" 5.5"x7.5" 6"x6" 6.5"x6.5"
.006" - - - -
.001" - - - -
.015" - - -
.020"
.025"
.040"
.060"
.070"-.25"

The surface conditons are as fired or lapped as per client's requirement

Tolerance

Thickness +/-7%, NLT .002"
Length & Width +.004" -.002"
Camber ≤.002"/inch

Scribing to scribing

+/- .002"
Hole

φ.008"~.07" (+/- .002")

φ.07"~0.4" (+/- .004")

0.4"~ (+/- .006")

Center to center distance of holes +/- .002"
Surface .001-.002 μm Ra

AlN Property

  TecAN-170 TecAN-210
Color Grey/Translucent Grey Grey/Beige
Bulk Density g/cm3 3.32 3.33
Apparent Porosity % 0 0
Flexural Strength MPa 400 300
Hardness GPa 10 9
Young’s Modulus of Elasticity GPa 320 320
Poisson’s Ratio 0.24 0.24
Thermal Expansion 20 – 1000°C, 10-6 K-1 4.8 4.6
Thermal Conductivity (25°C) W/m°K 170 210
Dielectric Constant 1 MHz 8.8 8.9
Dielectric Strength kV/mm 31 27

    Request a Quote

    Fill in our online form to get a fast quote. for more general enquiries please email us at sales@techceramic.com